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Solder Paste Mixer
Solder Paste Mixer can mix the solder paste to a liquid state effectively and evenly to acheive better results of stencil printing and reflowing processes. Using the mixer also can reduce the chances of air moisture as it is no longer necessary to remove the lid of the solder paste jar before the paste is actually used in production.
- The solder cream jars are placed in 45 angle, and run around its axis line, so the solder cream will not ahere to the jar cover.
- Double security design to asure the safety of operators.
- The air bubbles can be eliminated while the solder paste is being mixed. .
- The contorl of the solder paste mixing is considered fully with using special control circuit.
- The rotating speed has proved by practice, so the impact against the tin power and the effect to solder paste quality in the rising temperature are avioded.
| Working Power |
220V AC(50hz) 60W
110VAC(60hz) 60W(for choose)
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| Rotating Speed |
Primary rotating:1000RPM;Sencond rotating:380RPM |
| Working Capacity |
500g*2jar
1000g*2jar |
| Tin Pot's Size |
M diameterΦ60-Φ67standard one
S diameterΦ53-Φ60(for choose, please contact the supplier)
L diameterΦ67-Φ74(for choose, please contact the supplier) |
| Time Setting |
0.1～9.9mins, adjust0.1min per time;
10～30mins, adjust1.0min per time.
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| Display & Caution |
LEDdigital display、light blink and buzzer warning |
| Machine's Dimension |
420*420*427mm(W*D*H) |
| Packing Dimension |
520*510*490mm(W*D*H) |
| Net/Gross Weight |
30KG/32KG |
The air bubbles can be eliminated while the solder paste is being mixed.
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